COIN612

Description

The COIN612 belongs to the COIN series of infrared thermal camera cores developed by Global Sensor Technology (GST). Built on advanced 12μm VOx microbolometer technology, it integrates a 640×512 wafer-level-package (WLP) infrared thermal detector with high-performance signal processing circuitry and image processing algorithms.

It offers precise visualization and sharp, crisp images while remaining compact and affordable. An optional thermography function measures from -20℃ to 550℃ for industrial temperature measurement.

The module is light, small and power-efficient, with several interface options: DVP/LVDS multi-mode image output, RAW/YUV image data output and serial port control. Its fully optimized structure, low power draw and standard interfaces allow it to be supplied in standard configurations that integrate easily into many infrared products, such as thermal imagers and infrared thermographic cameras.

Its low weight, flexibility and industry-standard interfaces make secondary development and integration straightforward for OEM customers building all kinds of infrared thermal cameras, and customized OEM solutions are also available. It can be integrated readily into unmanned aerial vehicles (UAVs) and drones, as well as equipment used by police and firefighting units.

Backed by GST’s range of mature, stable thermal imaging solutions, the COIN series is easier to integrate into more end products and substantially reduces costs for customers.