CL612 / CL612T
An ultra-compact 17.3mm SWaP-class infrared core with in-house wafer-level packaging, offered in imaging and thermography versions, drawing under 0.5W and supporting MIPI, USB and CVBS interfaces.
Description
The CL612 / CL612T is an ultra-compact, SWaP-class (size, weight and power) infrared camera core measuring just 17.3 × 17.3 mm. It is built on a self-developed wafer-level-packaged detector and comes in two versions: the CL612 for thermal imaging and the CL612T, which adds temperature measurement.
The core delivers a 640 × 512 resolution at 12 μm pixel pitch with a thermal sensitivity of ≤ 40 mK, while keeping power consumption below 0.5W. It supports several interfaces, including MIPI, USB and CVBS, and the thermography version can be specified with an accuracy of ±2°C or ±2%.
Key Feature
- Wafer-level packaging in an ultra-compact form factor
- Resolution / pixel pitch: 640×512 / 12μm
- NETD: ≤ 40 mK (@25°C)
- Size / power: 17.3×17.3mm / <0.5W
- Temperature accuracy: ±2°C or ±2% (optional)
Specification
| Model | CL612 / CL612T |
| Detector Type | Uncooled VOx (vanadium oxide) focal plane array detector |
| Resolution | 640 × 512 |
| Pixel Pitch | 12 μm |
| Spectral Response | 8 ~ 14 μm |
| Thermal Sensitivity (NETD) | ≤ 40 mK (@25°C, F1.0) |
| Frame Rate | 25Hz / 30Hz / 50Hz |
| Dimensions | 17.3 × 17.3 × 20.2 mm (without lens) |
| Typical Power Consumption | < 0.5W |
| Digital Video Interface | MIPI / USB2.0 / DVP |
| Analog Video Interface | CVBS (PAL / NTSC) |
| Temperature Range (CL612T) | -20°C ~ +150°C, 0°C ~ +550°C |
| Temperature Accuracy | ±2°C or ±2% (whichever is greater) |
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