Description
Turing L256 Uncooled Infrared Module (Temperature Measurement)
The Turing L256 uncooled infrared module incorporates a high-performance 256×192 wafer detector with an 18×18 mm size. Its highly integrated architecture sets new benchmarks for size, weight, and power consumption (SWaP³) within the OEM module sector. Positioned as a cost-effective solution, it is suitable for a broad range of applications, including industrial automation, power systems, security, and machine vision.
With a resolution of 256×192 and a compact 18 mm × 18 mm form factor, it aligns with the L384 mechanical interface to ensure seamless compatibility in system design.
It supports a wide temperature measurement range from -20°C to +550°C, meeting the requirements of various application scenarios.
- Field of View (FOV): 20° to 90°
- Expandable interfaces: DVP and USB support





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